SPTS Vapor HF
Function
The SPTS Vapor HF is used to etch oxides layers, usually employed as sacrificial layers, to release structures via dry vapor etching. It is primarily used to release silicon MEMS structures. Through this process it is possible to eliminate stiction, increase the devices yield, provide stable performances and make the etching process compatible with a wide variety of materials and metals.
Gasses
HF, Ethanol, N2
Wafer Dimension
Standard substrates: 4 to 6 inches (100 to 150 mm) wafers, smaller samples can be introduced on a carrier wafer.
Temperature Range
Room Temperature.
Contamination
semi-Contaminated tool: both clean and contaminated wafers (or dies) can be employed in this machine.
Remarks
NA
