Packaging & Assemby
Here are reported all the tools employable at Else Kooi Laboratory for Packaging & Assembly. More information, and news will be posted on NIS System.
Accelonix TPT
Al/Au wire bonder.
AML Bonder
Wafer bonder.
DISCO DAD321
Saw dicing tool.
TRESKY T-3000-Pro
Die Bonder.